2 edition of Advances in electronic packaging--2005 found in the catalog.
Advances in electronic packaging--2005
|Other titles||Integration and Packaging of MEMS, NEMS, and electronic systems, InterPACK"05|
|Statement||sponsored by Electronic and Photonic Packaging Division, ASME.|
|Contributions||American Society of Mechanical Engineers. Electronic and Photonic Packaging Division., ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2005 : San Francisco, Calif.)|
|LC Classifications||TK7870.15 .A353 2005|
|The Physical Object|
|Pagination||3 pts. :|
Electronic packaging is the primary concern for high temperature electronics. Thermal cycling tests have shown that the current packaging trends such as BGA and QFN (quad-flat-no-leads) driven by computer and portable products must be re-evaluated to ensure reliability in harsh automotive environments [ 12 ]. Advances in Electronic Ceramic Materials Published May by The American Ceramic Society. Written in English There's no description for this book yet.
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Get this from a library. Advances in electronic packaging presented at ASME/Pacific Rim Technical Conference and Exhibition on Integration and Advances in electronic packaging--2005 book of MEMS, NEMS, and Electronic Systems: July, San Francosco, California, USA. [American Society of Mechanical Engineers.
Electronic and Photonic Packaging Division.;]. The amount of the advance against royalties is based on many factors: the size of the publisher, the historical performance of similar books in the marketplace; the author's track record and author platform or both; and the topicality of the book.
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Get this from a library. Advances in electronic packaging, presented at International Electronic Packaging Technical Conference and Exhibition: July, Maui, Hawaii. [American Society of Mechanical Engineers. Electronic and Photonic Packaging Division.;].
Get this from a library. Advances in electronic packaging, presented at the Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference & Exhibition: July, Kauai, Hawaii.
[Yung-Cheng Lee; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.;]. Reviews and Testimonials "I must commend the editors for a most timely book. Electronic Marketing is, without a doubt, an area on the forefront of marketing today, as noted by the observation in Marketing News, June 15th, that 'e-commerce will nearly double in the year '[Advances in Electronic Marketing] includes not only online marketing issues, but other electronic marketing topics.
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Advances in Electronic Circuit Packaging Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado.
ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging - San Francisco, CA Duration: Jul 17 → Jul. The book is intended for graduate students, engineers, and researchers.
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